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| october 2000 pa g e 1 isd5116 advance information single-chip voice record/playback device up to 16-minute duration with digital storage capability features summary 28-pin tsop isd5116 soic isd5116 fully-integrated solution ! single-chip voice record/playback solution ! dual storage of digital and analog information low power consumption ! +2.7 to +3.3v (v cc ) supply voltage ! supports 2.0v and 3.0v interface logic ! operating current: " i cc play = 15 ma (typical) " i cc rec = 30 ma (typical) " i cc feedthrough = 12 ma (typical) ! standby current: " i sb = 1 a (typical) ! most stages can be individually powered down to minimize power consumption enhanced voice features ! one or two-way conversation record ! one or two-way message playback ! voice memo record and playback ! private call screening ! in-terminal answering machine ! personalized outgoing message ! private call announce while on call digital memory features ! up to 4 mb available ! storage of phone numbers, system configuration parameters and message address table in cellular application easy-to-use and control ! no compression algorithm development required ! user-controllable sampling rates ! programmable analog interface ! fast mode i 2 c serial interface (400 khz) ! fully addressable to handle multiple messages high quality solution ! high quality voice and music reproduction ! isd?s standard 100-year message retention (typical) ! 100k record cycles (typical) for analog data ! 10k record cycles (typical) for digital data options ! available in die form, bga (available upon request), tsop and soic ! extended (-20 to +70c) and industrial (-40 to +85c) available
october 2000 pa g e 1 isd5116 advance information single-chip voice record/playback device up to 16-minute duration with digital storage capability features summary 28-pin tsop isd5116 soic isd5116 fully-integrated solution ! single-chip voice record/playback solution ! dual storage of digital and analog information low power consumption ! +2.7 to +3.3v (v cc ) supply voltage ! supports 2.0v and 3.0v interface logic ! operating current: " i cc play = 15 ma (typical) " i cc rec = 30 ma (typical) " i cc feedthrough = 12 ma (typical) ! standby current: " i sb = 1 a (typical) ! most stages can be individually powered down to minimize power consumption enhanced voice features ! one or two-way conversation record ! one or two-way message playback ! voice memo record and playback ! private call screening ! in-terminal answering machine ! personalized outgoing message ! private call announce while on call digital memory features ! up to 4 mb available ! storage of phone numbers, system configuration parameters and message address table in cellular application easy-to-use and control ! no compression algorithm development required ! user-controllable sampling rates ! programmable analog interface ! fast mode i 2 c serial interface (400 khz) ! fully addressable to handle multiple messages high quality solution ! high quality voice and music reproduction ! isd?s standard 100-year message retention (typical) ! 100k record cycles (typical) for analog data ! 10k record cycles (typical) for digital data options ! available in die form, bga (available upon request), tsop and soic ! extended (-20 to +70c) and industrial (-40 to +85c) available october 2000 pa g e 2 product description the isd5116 chipcorder ? product provides high quality, fully integrated, single-chip record/playback solutions for 8- to 16-minute messaging applications that are ideal for use in cellular phones, automotive communications, gps/navigation systems and other portable products. the isd5116 product is an enhancement of the isd5000 architecture, providing: 1) the i 2 c serial port - address, control and duration selection are accomplished through an i 2 c interface to minimize pin count (only two control lines required); 2) the capability of the storage array to store digital, in addition to analog, information. these features allow customers to store phone book numbers, system configuration parameters and message address pointers for message management capability. analog functions and audio gating have also been integrated into the isd5116 product to allow easy interface with integrated digital cellular chip sets on the market. audio paths have been designed to enable full duplex conversation record, voice memo, answering machine (including outgoing message playback) and call screening features. this product enables playback of messages while the phone is in standby, and both simplex and duplex playback of messages while on a phone call. additional voice storage features for digital cellular include: 1) a personalized outgoing message can be sent to the person by getting caller-id information from the host chipset 2) a private call announce while on call can be heard from the host by giving caller-id on call waiting information from the host chipset. logic interface options of 2.0v and 3.0v are supported by the isd5 116 to accommodate portable communication products customers (2.0- and 3.0-volt required). like other chipcorder ? products, the isd5116 integrates the sampling clock, anti-aliasing and smoothing filters, and the multi-level storage array on a single-chip. for enhanced voice features, the isd5116 eliminates external circuitry by integrating automatic gain control (agc), a power amplifier/speaker driver, volume control, summing amplifiers, analog switches, and a car kit interface. input level adjustable amplifiers are also included, providing a flexible interface for multiple applications. recordings are stored in on-chip nonvolatile memory cells, providing zero-power message storage. this unique, single-chip solution is made possible through isd?s patented multilevel storage technology. voice and audio signals are stored directly into solid-state memory in their natural, uncompressed form, providing superior quality voice and music reproduction. isd5116 block diagram aux in amp 1.0 / 1.4 / 2.0 / 2.8 agc sum1 mux vol mux filter mux low pass filter sum1 fthru inp ana out mux vol sum2 ana in vol sp+ sp- speaker aux out ana out- ana out+ mic+ mic - agccap microphone aux in xclk ana in v ssa v cca v ssa v ssd v ssd v ccd v ccd 64-bit/samp. array output mux array input mux input source mux array i/o mux filto sum1 inp ana in sum2 filto sum2 sum1 summing amp ana in amp 0.625/0.883/1.25/1.76 6db sum2 summing amp output mux volume control mic in aux in filto ana in sum1 ana in filto sum2 (analog) array inp sum1 mux ctrl (digital) 64-bit/samp. array out (analog) array out (digital) array spkr. amp aux out amp power conditioning rac int sda scl a1a0 device control internal clock multilevel/digital storage array ana out amp ? ? 2 ( ) vls0 vls1 2 ( ) aig0 aig1 2 ( ) axg0 axg1 2 ( ) s1s0 s1s1 2 ( ) s1m0 s1m1 2 ( ) s2m0 s2m1 ( ) opa0 opa1 2 ( ) ops0 ops1 2 ( ) fld0 fld1 2 (ins0) 1 1 (axpd) 1 (agpd) 1 (flpd) 1 (fls0) 1 (aipd) 1 (aopd) ( ) 3 aos0 aos1 aos2 3 ( ) vol0 vol1 vol2 1 (v lpd ) october 2000 pa g e 3 table of contents isd5116............................................................................................................................................ 1 1 overview.................................................................................................................. .................. 5 1.1 speech/sound quality ....................................................................................................... 5 1.2 duration.............................................................................................................................. 5 1.3 flash storage............................................................................................................... ...... 5 1.4 microcontroller interface ................................................................................................... . 5 1.5 programming...................................................................................................................... 5 2 functional description ........................................................................................................ ... 6 2.1 internal registers............................................................................................................... 7 2.2 memory organization......................................................................................................... 7 2.3 pinout table ....................................................................................................................... 8 3 operational modes description ............................................................................................. 9 3.1 i 2 c interface ....................................................................................................................... 9 3.2 command byte ................................................................................................................ 11 3.3 opcode summary............................................................................................................ 11 3.4 data bytes.................................................................................................................. ...... 13 3.5 configuration register bytes ........................................................................................... 13 3.6 power-up sequence......................................................................................................... 15 3.7 feed through mmde......................................................................................................... 15 3.8 call record ...................................................................................................................... 17 3.9 memo record................................................................................................................... 18 3.10 memo and call playback ................................................................................................. 19 3.11 message cueing ............................................................................................................. . 20 4 analog mode................................................................................................................... ....... 21 4.1 aux in and ana in description ......................................................................................... 21 4.2 analog structure (left half) description............................................................................. 22 4.3 analog structure (right half) description........................................................................... 22 4.4 volume control description ............................................................................................. 23 4.5 apeaker and aux out description.................................................................................... 23 4.6 ana out description......................................................................................................... 24 4.7 analog inputs ................................................................................................................... 24 5 digital mode .................................................................................................................. ......... 27 5.1 writing data ..................................................................................................................... 27 5.2 reading data ................................................................................................................... 27 5.3 erasing data .................................................................................................................... 27 5.4 example command sequences ...................................................................................... 28 6 pin descriptions .............................................................................................................. ...... 31 6.1 digital i/o pins ............................................................................................................ ..... 31 6.2 analog i/o pins ............................................................................................................. ... 33 6.3 power and ground pins................................................................................................... 36 6.4 sample pc layout ........................................................................................................... 36 7 electrical characteristics and parameters ......................................................................... 37 7.1 electrical characteristics.................................................................................................. 37 7.2 parameters.................................................................................................................. ..... 38 8 timing diagrams ............................................................................................................... .... 45 8.1 i 2 c timing diagram.......................................................................................................... 45 8.2 playback and stop cycle ................................................................................................. 45 8.3 example of power up command (first 12 bits)................................................................ 46 october 2000 pa g e 4 9i 2 c serial interface technical information .......................................................................... 47 9.1 characteristics of the i 2 c serial interface ........................................................................ 47 9.2 i 2 c protocol ..................................................................................................................... . 49 10 device physical dimensions ............................................................................................ 51 10.1. plastic thin small outline package (tsop) type e dimensions................................ 51 10.2. plastic small outline integrated circuit (soic) dimensions.......................................... 52 10.3. plastic dual inline package (pdip) dimensions.......................................................... 53 10.4. die bonding physical layout........................................................................................ 54 11 ordering information......................................................................................................... 56 october 2000 pa g e 5 1. overview 1.1 speech/sound quality the isd5116 chipcorder product can be configured via software to operate at 4.0, 5.3, 6.4 and 8.0 khz sampling frequencies, allowing the user a choice of speech quality options. increasing the duration decreases the sampling frequency and bandwidth, which affects sound quality. the table in the following section compares filter pass band and product durations. 1.2 duration to meet end-system requirements, the isd5116 device is a single-chip solution, which provides from 8 to 16 minutes of voice record and playback, depending on the sample rates defined by customer software. input sample rate (khz) duration 1 typical filter knee (khz) 8.0 8 min 44 sec 3.4 6.4 10 min 55 sec 2.7 5.3 13 min 6 sec 2.3 4.0 17 min 28 sec 1.7 1. minus any pages selected for digital storage 1.3 flash storage one of the benefits of isd?s chipcorder technology is the use of on-chip nonvolatile memory, which provides zero-power message storage. the message is retained for up to 100 years (typically) without power. in addition, the device can be re-recorded over 10,000 times (typically) for the digital messages and over 100,000 times (typically) for the analog messages. a new feature has been added that allows memory space in the isd5116 to be allocated to either digital or analog storage when recorded. the fact that a section has been assigned digital or analog data is stored in the message address table by the system microcontroller when the recording is made. 1.4 microcontroller interface the isd5116 is controlled through an i 2 c 2-wire interface. this synchronous serial port allows commands, configurations, address data, and digital data to be loaded to the device, while allowing status, digital data and current address information to be read back from the device. in addition to the serial interface, two other pins can be connected to the microcontroller for enhanced interface. these are the rac timing pin and the int pin for interrupts to the controller. communications with all the internal registers are through the serial bus, as well as digital memory read and write operations. 1.5 programming the isd5116 series is also ideal for playback-only applications, where single or multiple messages may be played back when desired. playback is controlled through the i 2 c interface. once the desired message configuration is created, duplicates can easily be generated via a third-party programmer. for more information on available application tools and programmers, please see the isd web site at www.winbond-usa.com october 2000 pa g e 6 2 functional description the isd5116 is a single chip solution for voice and analog storage that also includes the capability to store digital information in the memory array. the array may be divided between analog and digital storage, as the user chooses, when configuring the device. the device consists of several sections that will be described in the following paragraphs. looking at the block diagram below, one can see that the isd5116 may be very easily designed into a cellular phone. placing the device between the microphone and the existing voice encoder chip takes care of the transmit path. the ana in is connected between one of the speaker leads on the voice decoder chip and the speaker is connected to the speaker pins of the isd5116. two pins are needed for the i 2 c digital control and digital information for storage. starting at the microphone inputs, the signal from the microphone can be routed directly through the chip to the ana out pins through a 6 db amplifier stage. or, the signal can be passed through the agc amplifier and directed to the ana out pins, directed to the storage array, or mixed with voice from the receive path coming from ana in and be directed to the same places. in addition, if the phone is inserted into a "hands-free" car kit, then the signal from the pickup microphone in the car can be passed through to the same places from the aux in pin and the phone's microphone is switched off. under this situation, the other party's voice from the phone is played into ana in and passed through to the aux out pin that drives the car kit's loudspeaker. depending upon whether one desires recording one side (simplex) or both sides (duplex) of a conversation, the various paths will also be switched through to the low pass filter (for anti-aliasing) and into the storage array. later, the cell phone owner can play back the messages from the array. when this happens the array output mux is connected to the volume control through the output mux to the speaker amplifier. for applications other than a cell phone, the audio paths can be switched into many different configurations, providing great flexibility. rf section mic in+ mic in- sp out- sp out+ vb codec dsp 123456789 bb codec baseband ana out+ ana out- sp+ sp- mic+ mic- ana in sda, scl aux in aux out car kit earpiece speaker keyboard display isd5116 microcontroller october 2000 pa g e 7 2.1 internal registers the isd5116 has multiple internal registers that are used to store the address information and the configuration or set-up of the device. the two 16-bit configuration registers control the audio paths through the device, the sample frequency, the various gains and attenuations, the sections powered up and down, and the volume settings. these registers are discussed in detail in section 3.5 on page 13. 2.2 memory organization the isd5116 memory array is arranged as 2048 rows (or pages) of 2048 bits for a total memory of 4,194,304 bits. the primary addressing for the 2048 pages is handled by 11 bits of address data in the analog mode. at the 8 khz sample rate, each page contains 256 milliseconds of audio. thus at 8 khz there is actually room for 8 minutes and 44 seconds of audio. a memory page is 2048 bits organized as thirty-two 64-bit "blocks" when used for digital storage. the contents of a page are either analog or digital. this is determined by instruction (op code) at the time the data is written. a record of what is analog and what is digital, and where, is stored by the system microcontroller in the message address table (mat). the mat is a table kept in the microcontroller memory that defines the status of each message ?block.? it can be stored back into the isd5116 if the power fails or the system is turned off. using this table allows for efficient message management. segments of messages can be stored wherever there is available space in the memory array. [this is explained in detail for the isd5008 in applications note #9 and will be similarly described in a later note for the isd5116.] when a page is used for analog storage, the same 32 blocks are present but there are 8 eom (end-of- message) markers. this means that for each 4 blocks there is an eom marker at the end. thus, when recording, the analog recording will stop at any one of eight positions. at 8 khz, this results in a resolution of 32 msec when ending an analog recording. beginning an analog recording is limited to the 256 msec resolution provided by the 11-bit address. a recording does not immediately stop when the stop command is given, but continues until the 32 millisecond block is filled. then a bit is placed in the eom memory to develop the interrupt that signals a message is finished playing in the playback mode. digital data is sent and received serially over the i 2 c interface. the data is serial-to-parallel converted and stored in one of two alternating (commutating) 64-bit shift registers. when an input register is full, it becomes the register that is parallel written into the array. the prior write register becomes the new serial input register. a mechanism is built-in to ensure there is always a register available for storing new data. storing data in the memory is accomplished by accepting data one byte at a time and issuing an acknowledge. if data is coming in faster than it can be written, the chip issues an acknowledge to the host microcontroller, but holds scl low until it is ready to accept more data. the read mode is the opposite of the write mode. data is read into one of two 64-bit registers from the array and serially sent to the i 2 c interface. (see section 5 on page 27 for details). october 2000 pa g e 8 2.3 pinout table pin name pin no. 28-pin tsop pin no. 28-pin soic functionality rac 3 24 row address clock; an open drain output. the rac pin goes low t raclo 1 before the end of each row of memory and returns high at exactly the end of each row of memory. int 4 25 interrupt output; an open drain output that indicates that a set eom bit has been found during playback or that the chip is in an overflow (ovf) condition. this pin remains low until a read status command is executed. xclk 5 26 this pin allows the internal clock of the device to be driven externally for enhanced timing precision. this pin is grounded for most applications. scl 8 1 serial clock line is part of the i 2 c interface. it is used to clock the data into and out of the i 2 c interface. sda 10 3 serial data line is part of the i 2 c interface. data is passed between devices on the bus over this line. a0 11 4 input pin that supplies the lsb for the i 2 c slave address. a1 9 2 input pin that supplies the lsb +1 bit for the i 2 c slave address. mic+ 16 8 differential positive input to the microphone amplifier. mic- 17 10 differential negative input to the microphone amplifier. ana out+ 18 11 differential positive analog output for ana out of the device. ana out- 19 12 differential negative analog output for ana out of the device. acap 20 13 agc capacitor connection. required for the on-chip agc amplifier. sp+ 23 16 differential positive speaker driver output. sp- 21 14 differential negative speaker driver output. when the speaker outputs are in use, the aux out output is disabled. ana in 25 18 analog input. this is one of the gain adjustable analog inputs of the device. aux in 26 19 auxiliary input. this is one of the gain adjustable analog inputs of the device. aux out 27 20 auxiliary output. this is one the analog outputs of the device. when this output is in use, the sp+ and sp- outputs are disabled. vccd 6,7 27,28 positive digital supply pins. these pins carry noise generated by internal clocks in the chip. they must be carefully bypassed to digital ground to insure correct device operation. vssd 12,13 5,6 digital gr ound pins. vssa 2,15,22 9,15,23 analog gr ound pins. vcca 24 17 positive analog supply pin. this pin supplies the low level audio sections of the device. it should be carefully bypassed to analog ground to insure correct device operation. nc 1,14,28 7,21,22 no connect. 1 see the parameters section of on page 38. october 2000 pa g e 9 3 operational modes description 3.1 i 2 c interface important note: the rest of this data sheet will assume that the reader is familiar with the i 2 c serial interface. additional information on i 2 c may be found in section 9.0 on page 47 of this document. if you are not familiar with this serial protocol, please read this section to familiarize yourself with it. a large amount of additional information on i 2 c can also be found on the philips web page at http://www.philips.com/ . 3.1.1 i 2 c slave address the isd5116 has a 7-bit slave address of <100 00xy> where x and y are equal to the state, respectively, of the external address pins a1 and a0. because all data bytes are required to be 8 bits, the lsb of the address byte is the read/write selection bit that tells the slave whether to transmit or receive data. therefore, there are 8 possible slave addresses for the isd5116. these are: a1 a0 slave address r/w bit hex value 0 0 <100 0000> 0 80 0 1 <100 0001> 0 82 1 0 <100 0010> 0 84 1 1 <100 0011> 0 86 0 0 <100 0000> 1 81 0 1 <100 0001> 1 83 1 0 <100 0010> 1 85 1 1 <100 0011> 1 87 to use more than four isd5116 devices in an application requires some external switching of the i 2 c interface. 3.1.2 isd5116 i 2 c operation definitions there are many control functions used to operate the isd5116. among them are: 1. read status command : the read status command is a read request from the host processor to the isd5116 without delivering a command byte. the host supplies all the clocks (scl). in each case, the entity sending the data drives the data line (sda). the read status command is executed by the following i 2 c sequence. 1. host executes i 2 c start 2. send slave address with r/w bit = ?1? (read) 81h 3. slave (isd5116) responds back to host an acknowledge (ack) followed by 8-bit status word 4. host sends an acknowledge (ack) to slave 5. wait for scl to go high 6. slave responds with upper address byte of internal address register 7. host sends an ack to slave 8. wait for scl to go high conventions used in i 2 c data transfer diagrams = start condition = stop condition = 8-bit data transfer = ?1 ? i n t h e r / w b i t = ?0 ? i n t h e r / w b i t = ack (acknowledge) = no ack w s slave address r a data p = host to slave (gray) = slave to host (w hite) the box color indicates the direction of data flow = 7-bit slave address n october 2000 pa g e 1 0 9. slave responds with lower address byte of internal address register (a[4:0] will always return set to 0.) 10. host sends a no ack to slave, then executes i 2 c stop note that the processor could have sent an i 2 c stop after the status word data transfer and aborted the transfer of the address bytes. a graphical representation of this operation is found below. see the caption box above for more explanation. 2. load command byte register (single byte load ): a single byte may be written to the command byte register in order to power up the device, start or stop analog record (if no address information is needed), or do a message cueing function. the command byte register is loaded as follows: 1. host executes i 2 c start 2. send slave address with r/w bit = ?0? (write) [80h] 3. slave responds back with an ack. 4. wait for scl to go high 5. host sends a command byte to slave 6. slave responds with an ack 7. wait for scl to go high 8. host executes i 2 c stop 3. load command byte register (address load): for the normal addressed mode the registers are loaded as follows: 1. host executes i 2 c start 2. send slave address with r/w bit = ?0? (write) 3. slave responds back with an ack. 4. wait for scl to go high 5. host sends a byte to slave - (command byte) 6. slave responds with an ack 7. wait for scl to go high 8. host sends a byte to slave - (high address byte) 9. slave responds with an ack 10. wait for scl to go high 11. host sends a byte to slave - (low address byte) 12. slave responds with an ack 13. wait for scl to go high 14. host executes i 2 c stop s slave address a a data p r data data a n status high addr. low addr. s slave address a data p w command byte a s slave address a p w command data a data a data a high addr. low addr. october 2000 pa g e 1 1 3.1.3 i 2 c control registers the isd5116 is controlled by loading commands to, or, reading from, the internal command, configuration and address registers. the command byte sent is used to start and stop recording, write or read digital data and perform other functions necessary for the operation of the device. 3.2 command byte control of the isd5116 is implemented through an 8-bit command byte, sent after the 7-bit device address and the 1-bit read/write selection bit. the 8 bits are: ! global power up bit ! dab bit: determines whether device is performing an analog or digital function ! 3 function bits: these determine which function the device is to perform in conjunction with the dab bit. ! 3 register address bits: these determine if and when data is to be loaded to a register c7 c6 c5 c4 c3 c2 c1 c0 pu dab fn2 fn1 fn0 rg2 rg1 rg0 function bits register bits function bits the command byte function bits are detailed in the table to the right. c6, the dab bit, determines whether the device is performing an analog or digital function. the other bits are decoded to produce the individual commands. not all decode combinations are currently used, and are reserved for future use. out of 16 possible codes, the isd5116 uses 7 for normal operation. the other 9 are undefined. register bits the register load may be used to modify a command sequence (such as load an address) or used with the null command sequence to load a configuration or test register. not all registers are accessible to the user. [rg2 is always 0 as the four additional combinations are undefined.] 3.3 opcode summary opcode command description the following commands are used to access the chip through the i 2 c interface. ! play: analog play command ! record: analog record command ! message cue: analog message cue command ! read: digital read command ! write: digital write command command bits c6 c5 c4 c3 dab fn2 fn1 fn0 function 0 0 0 0 stop (or do nothing) 0101analog play 0010analog record 0111analog mc 1 1 0 0 digital read 1 0 0 1 digital w rite 1 0 1 0 erase (row) rg2 rg1 rg0 c2 c1 c0 function 0 0 0 no action 0 0 1 load address 0 1 0 load cfg0 0 1 1 load cfg1 power up bit october 2000 pa g e 1 2 ! erase: digital page and block erase command ! power up: global power up/down bit. (c7) ! load address: load address register (is incorporated in play, record, read and write commands) ! load cfg0: load configuration register 0 ! load cfg1: load configuration register 1 ! read status: read the interrupt status and address register, including a hardwired device id opcode command byte table pwr function bits register bits opcode hex pu da b fn 2 fn 1 fn 0 rg 2 rg 1 rg 0 command bit number cmd c7 c6 c5 c4 c3 c2 c1 c0 power up 80 1 0 0 0 0 0 0 0 power down 00 0 0 0 0 0 0 0 0 stop (do nothing) stay on 801 0 0000 0 0 stop (do nothing) stay off 000 0 0000 0 0 load address 811 0 0000 0 1 load cfg0 821 0 0000 1 0 load cfg1 831 0 0000 1 1 record analog 90 1 0 0 1 0 0 0 0 record analog @ addr 91 1 0 0 1 0 0 0 1 play analog a8 1 0 1 0 1 0 0 0 play analog @ addr a9 1 0 1 0 1 0 0 1 msg cue analog b8 1 0 1 1 1 0 0 0 msg cue analog @ addr b9 1 0 1 1 1 0 0 1 erase digital page d0 1 1 0 1 0 0 0 0 erase digital page @ addr d11 1 0100 0 1 write digital c81 1 0010 0 0 write digital @ addr c9 1 1 0 0 1 0 0 1 read digital e0 1 1 1 0 0 0 0 0 read digital @ addr e1 1 1 1 0 0 0 0 1 read status 1 n/a n/a n/a n/a n/a n/a n/a n/a n/a 1. see section 3.1.2 on page 9 for details. october 2000 pa g e 1 3 3.4 data bytes in the i 2 c write mode, the device can accept data sent after the command byte. if a register load option is selected, the next two bytes are loaded into the selected register. the format of the data is msb first, the i 2 c standard. thus to load data<15:0> into the device, data<15:8> is sent first, the byte is acknowledged, and data<7:0> is sent next. the address register consists of two bytes. the format of the address is as follows: address<15:0> = page_address<10:0>, block_address<4:0> note: if an analog function is selected, the block address bits must be set to 0000. digital read and write are block addressable . when the device is polled with the read status command, it will return three bytes of data. the first byte is the status byte, the next the upper address byte and the last the lower address byte. the status register is one byte long and its bit function is: status<7:0> = eom, ovf, ready, pd, prb, device_id<2:0> lower address byte will always return the block address bits as zero, either in digital or analog mode. the functions of the bits are: eom indicates whether an eom interrupt has occurred. ovf indicates whether an overflow interrupt has occurred. ready indicates the internal status of the device ? if ready is low no new commands should be sent to device. pd device is powered down if pd is high. prb play/record mode indicator. high=play/low =record. device_id an internal device id. this is 001 for the isd5116. it is recommended that you read the status register after a write or record operation to ensure that the device is ready to accept new commands. depending upon the design and the number of pins available on the controller, the polling overhead can be reduced. if int and rac are tied to the microcontroller, it does not have to poll as frequently to determine the status of the isd5116. 3.5 configuration register bytes the configuration register bytes are defined, in detail, in the drawings of section 4 on page 21. the drawings display how each bit enables or disables a function of the audio paths in the isd5116. the tables below give a general illustration of the bits. there are two configuration registers, cfg0 and cfg1, so there are four 8-bit bytes to be loaded during the set-up of the device. october 2000 pa g e 1 4 d15 d14 d13 d12 d11 d10 d9 d8 d7 d 6 d5 d4 d3 d2 d1 d0 configuration register 0 (cfg0) aig1 aig0 aipd axg1 axg0 axpd ins0 aos2 aos1 aos0 aopd ops1 ops0 opa1 opa0 vlpd volume control power down spkr & aux out control (2 bits) output mux select (2 bits) ana out power down auxout mux select (3 bits) input source mux select (1 bit) aux in power down aux in amp gain set (2 bits) ana in power down ana in amp gain set (2 bits) d15 d14 d13 d12 d11 d10 d9 d8 d7 d 6 d5 d4 d3 d2 d1 d0 configuration register 0 (cfg0) aig1 aig0 aipd axg1 axg0 axpd ins0 aos2 aos1 aos0 aopd ops1 ops0 opa1 opa0 vlpd volume control power down spkr & aux out control (2 bits) output mux select (2 bits) ana out power down auxout mux select (3 bits) input source mux select (1 bit) aux in power down aux in amp gain set (2 bits) ana in power down ana in amp gain set (2 bits) agc amp power down filter power down sample rate (& filter) set up (2 bits) filter mux select sum 2 summing amp control (2 bits) sum 1 summing amp control (2 bits) sum 1 mux select (2 bits) volume control (3 bits) volume cont. mux select (2 bits) configuration register 1 (cfg1) vls1 vls0 vol2 vol1 vol0 s1s1 s1s0 s1m1 s1m0 s2m1 s2m0 fls0 fld1 fld0 flpd agpd d15 d14 d13 d12 d11 d10 d9 d8 d7 d 6 d5 d4 d3 d2 d1 d0 agc amp power down filter power down sample rate (& filter) set up (2 bits) filter mux select sum 2 summing amp control (2 bits) sum 1 summing amp control (2 bits) sum 1 mux select (2 bits) volume control (3 bits) volume cont. mux select (2 bits) configuration register 1 (cfg1) vls1 vls0 vol2 vol1 vol0 s1s1 s1s0 s1m1 s1m0 s2m1 s2m0 fls0 fld1 fld0 flpd agpd d15 d14 d13 d12 d11 d10 d9 d8 d7 d 6 d5 d4 d3 d2 d1 d0 vls1 vls0 vol2 vol1 vol0 s1s1 s1s0 s1m1 s1m0 s2m1 s2m0 fls0 fld1 fld0 flpd agpd d15 d14 d13 d12 d11 d10 d9 d8 d7 d 6 d5 d4 d3 d2 d1 d0 vls1 vls0 vol2 vol1 vol0 s1s1 s1s0 s1m1 s1m0 s2m1 s2m0 fls0 fld1 fld0 flpd agpd d15 d14 d13 d12 d11 d10 d9 d8 d7 d 6 d5 d4 d3 d2 d1 d0 october 2000 pa g e 1 5 3.6 power-up sequence this sequence prepares the isd5116 for an operation to follow, waiting the tpud time before sending the next command sequence. 1. send i 2 c power up 2. send one byte 10000000 {slave address, r/w = 0} 80h 3. slave ack 4. wait for scl high 5. send one byte 10000000 {command byte = power up} 80h 6. slave ack 7. wait for scl high 8. send i 2 c stop 3.6.1 playback mode the command sequence for an analog playback operation can be handled several ways. one technique would be to do a load address (81h), which requires sending a total of four bytes, and then sending a play analog, which would be a command byte (a8h) proceeded by the slave address byte. this is a total of six bytes plus the times for start, ack, and stop. another approach would be to incorporate both into a single four byte exchange, which consists of the slave address (80h), the command byte (a9h) for play analog @ address, and the two address bytes. 3.6.2 record mode the command sequence for an analog record would be a four byte sequence consisting of the slave address (80h), the command byte (91h) for record analog @ address, and the two address bytes. see ? load command byte register (address load) ? in section 3.1.2 on page 10. 3.7 feed through mode the previous examples were dependent upon the device already being powered up and the various paths being set through the device for the desired operation. to set up the device for the various paths requires loading the two 16-bit configuration registers with the correct data. for example, in the feed through mode the device only needs to be powered up and a few paths selected. this mode enables the isd5116 to connect to a cellular or cordless base band phone chip set without affecting the audio source or destination. there are two paths involved, the transmit path and the receive path. the transmit path connects the isd chip?s microphone source through to the microphone input on the base band chip set. the receive path connects the base band chip set?s speaker output through to the speaker driver on the isd chip. this allows the isd chip to substitute for those functions and incidentally gain access to the audio to and from the base band chip set. to set up the environment described above, a series of commands need to be sent to the isd5116. first, the chip needs to be powered up as described in this section. then the configuration registers must be filled with the specific data to connect the paths desired. in the case of the feed through mode, most of the chip can remain powered down. the following figure illustrates the affected paths. october 2000 pa g e 1 6 the figure above shows the part of the isd5116 block diagram that is used in feed through mode. the rest of the chip will be powered down to conserve power. the bold lines highlight the audio paths. note that the microphone to ana out +/? path is differential. to select this mode, the following control bits must be configured in the isd5116 configuration registers. to set up the transmit path: 1. select the fthru path thro ugh the ana out mux?bits aos0, aos1 and aos2 control the state of the ana out mux. these are the d6, d7 and d8 bits respectively of configuration register 0 (cfg0) and they should all be zero to select the fthru path. 2. power up the ana out amplifier?bit aopd controls the power up state of ana out. this is bit d5 of cfg0 and it should be a zero to power up the amplifier. to set up the receive path: 1. set up the ana in amplifier for the correct gain?bits aig0 and aig1 control the gain settings of this amplifier. these are bits d14 and d15 respectively of cfg0. the input level at this pin deter- mines the setting of this gain stage. the ana in amplifier gain settings table on page 25 will help determine this setting. in this example, we will assume that the peak signal never goes above 1 volt p-p single ended. that would enable us to use the 9 db attenuation setting, or where d14 is one and d15 is zero. 2. power up the ana in amplifier?bit aipd controls the power up state of ana in. this is bit d13 of cfg0 and should be a zero to power up the amplifier. 3. select the ana in path through the output mux?bits ops0 and ops1 control the state of the output mux. these are bits d3 and d4 respectively of cfg0 and they should be set to the state where d3 is one and d4 is zero to select the ana in path. 4. power up the speaker amplifier?bits opa0 and opa1 control the state of the speaker and aux amplifiers. these are bits d1 and d2 respectively of cfg0. they should be set to the state where d1 is one and d2 is zero. this powers up the speaker amplifier and configures it for its higher gain setting for use with a piezo speaker element and also powers down the aux output stage. the status of the rest of the functions in the isd5116 chip must be defined before the configuration registers settings are updated: october 2000 pa g e 1 7 1. power down the volume control element ? bit vlpd controls the power up state of the volume control. this is bit d0 of cfg0 and it should be set to a one to power down this stage. 2. power down the aux in amplifier ? bit axpd controls the power up state of the aux in input amplifier. this is bit d10 of cfg0 and it should be set to a one to power down this stage. 3. power down the sum1 and sum2 mixer amplifiers ? bits s1m0 and s1m1 control the sum1 mixer and bits s2m0 and s2m1 control the sum2 mixer. these are bits d7 and d8 in cfg1 and bits d5 and d6 in cfg1 respectively. all 4 bits should be set to a one to power down these two amplifiers. 4. power down the filter stage ? bit flpd controls the power up state of the filter stage in the device. this is bit d1 in cfg1 and should be set to a one to power down the stage. 5. power down the agc amplifier ? bit agpd controls the power up state of the agc amplifier. this is bit d0 in cfg1 and should be set to a one to power down this stage. 6. don?t care bits ? the following stages are not used in feed through mode. their bits may be set to either level. in this example, we will set all the following bits to a zero. (a). bit ins0, bit d9 of cfg0 controls the input source mux. (b). bits axg0 and axg1 are bits d11 and d12 respectively in cfg0. they control the aux in amplifier gain setting. (c). bits fld0 and fld1 are bits d2 and d3 respectively in cfg1. they control the sample rate and filter band pass setting. (d). bit fls0 is bit d4 in cfg1. it controls the filter mux. (e). bits s1s0 and s1s1 are bits d9 and d10 of cfg1. they control the sum1 mux. (f). bits vol0, vol1 and vol2 are bits d11, d12 and d13 of cfg1. they control the setting of the volume control. (g). bits vls0 and vls1 are bits d14 and d15 of cfg1. they control the volume control mux. the end result of the above set up is cfg0=0100 0100 0000 1011 (hex 440b) and cfg1=0000 0001 1110 0011 (hex 01e3). since both registers are being loaded, cfg0 is loaded, followed by the loading of cfg1. these two registers must be loaded in this order. the internal set up for both registers will take effect synchronously with the rising edge of scl. 3.8 call record the call record mode adds the ability to record an incoming phone call. in most applications, the isd5116 would first be set up for feed through mode as described above. when the user wishes to record the incoming call, the setup of the chip is modified to add that ability. for the purpose of this explanation, we will use the 6.4 khz sample rate during recording. the block diagram of the isd5116 shows that the multilevel storage array is always driven from the sum2 summing amplifier. the path traces back from there through the low pass filter, the filter mux, the sum1 summing amplifier, the sum1 mux, then from the ana in amplifier. feed through mode has already powered up the ana in amp so we only need to power up and enable the path to the multilevel storage array from that point: 1. select the ana in path through the sum1 mux?bits s1s0 and s1s1 control the state of the sum1 mux. these are bits d9 and d10 respectively of cfg1 and they should be set to the state where both d9 and d10 are zero to select the ana in path. october 2000 pa g e 1 8 2. select the sum1 mux input (only) to the s1 summing amplifier?bits s1m0 and s1m1 control the state of the sum1 summing amplifier. these are bits d7 and d8 respectively of cfg1 and they should be set to the state where d7 is one and d8 is zero to select the sum1 mux (only) path. 3. select the sum1 summing amplifier path through the filter mux?bit fls0 controls the state of the filter mux. this is bit d4 of cfg1 and it must be set to zero to select the sum1 sum- ming amplifier path. 4. power up the low pass filter?bit flpd controls the power up state of the low pass filter stage. this is bit d1 of cfg1 and it must be set to zero to power up the low pass filter stage. 5. select the 6.4 khz sample rate ? bits fld0 and fld1 select the low pass filter setting and sample rate to be used during record and playback. these are bits d2 and d3 of cfg1. to enable the 6.4 khz sample rate, d2 must be set to one and d3 set to zero. 6. select the low pass filter input (only) to the s2 summing amplifier ? bits s2m0 and s2m1 control the state of the sum2 summing amplifier. these are bits d5 and d6 respectively of cfg1 and they should be set to the state where d5 is zero and d6 is one to select the low pass filter (only) path. in this mode, the elements of the original pass through mode do not change. the sections of the chip not required to add the record path remain powered down. in fact, cfg0 does not change and remains cfg0=0100 0100 0000 1011 (hex 440b). cfg1 changes to cfg1=0000 0000 1100 0101 (hex 00c5). since cfg0 is not changed, it is only necessary to load cfg1. note that if only cfg0 was changed, it would be necessary to load both registers. 3.9 memo record the memo record mode sets the chip up to record from the local microphone into the chip?s multilevel storage array. a connected cellular telephone or cordless phone chip set may remain powered down and is not active in this mode. the path to be used is microphone input to agc amplifier, then through the input source mux to the sum1 summing amplifier. from there the path goes through the filter mux, the low pass filter, the sum2 summing amplifier, then to the multilevel storage array. in this instance, we will select the 5.3 khz sample rate. the rest of the chip may be powered down. 1. power up the agc amplifier?bit agpd controls the power up state of the agc amplifier. this is bit d0 of cfg1 and must be set to zero to power up this stage. 2. select the agc amplifier through the input so urce mux?bit ins0 controls the state of the input source mux. this is bit d9 of cfg0 and must be set to a zero to select the agc am- plifier. 3. select the input source mux (only) to the s1 summing amplifier ? bits s1m0 and s1m1 control the state of the sum1 summing amplifier. these are bits d7 and d8 respectively of cfg1 and they should be set to the state where d7 is zero and d8 is one to select the input source mux (only) path. 4. select the sum1 summing amplifier path through the filter mux?bit fls0 controls the state of the filter mux. this is bit d4 of cfg1 and it must be set to zero to select the sum1 summing amplifier path. october 2000 pa g e 1 9 5. power up the low pass filter ? bit flpd controls the power up state of the low pass filter stage. this is bit d1 of cfg1 and it must be set to zero to power up the low pass filter stage. 6. select the 5.3 khz sample rate?bits fld0 and fld1 select the low pass filter setting and sample rate to be used during record and playback. these are bits d2 and d3 of cfg1. to enable the 5.3 khz sample rate, d2 must be set to zero and d3 set to one. 7. select the low pass filter input (only) to the s2 summing amplifier ? bits s2m0 and s2m1 control the state of the sum2 summing amplifier. these are bits d5 and d6 respectively of cfg1 and they should be set to the state where d5 is zero and d6 is one to select the low pass filter (only) path. to set up the chip for memo record, the configuration registers are set up as follows: cfg0=0010 0100 0010 0001 (hex 2421). cfg1=0000 0001 0100 1000 (hex 0148). only those portions necessary for this mode are powered up. 3.10 memo and call playback this mode sets the chip up for local playback of messages recorded earlier. the playback path is from the multilevel storage array to the filter mux, then to the low pass filter stage. from there, the audio path goes through the sum2 summing amplifier to the volume mux, through the volume control then to the speaker output stage. w e will assume that we are driving a piezo speaker element. this audio was previously recorded at 8 khz. all unnecessary stages will be powered down. 1. select the multilevel storage array path through the filter mux ? bit fls0, the state of the filter mux. this is bit d4 of cfg1 and must be set to one to select the multilevel storage array. 2. power up the low pass filter ? bit flpd controls the power up state of the low pass filter stage. this is bit d1 of cfg1 and it must be set to zero to power up the low pass filter stage. 3. select the 8.0 khz sample rate?bits fld0 and fld1 select the low pass filter setting and sample rate to be used during record and playback. these are bits d2 and d3 of cfg1. to enable the 8.0 khz sample rate, d2 and d3 must be set to zero. 4. select the low pass filter input (only) to the s2 summing amplifier ?bits s2m0 and s2m1 control the state of the sum2 summing amplifier. these are bits d5 and d6 respectively of cfg1 and they should be set to the state where d5 is zero and d6 is one to select the low pass filter (only) path. 5. select the sum2 summing amplifier path through the volume mux ? bits vls0 and vls1 control the state volume mux. these bits are bits d14 and d15, respectively of cfg1. they should be set to the state where d14 is one and d15 is zero to select the sum2 summing amplifier. 6. power up the volume control level ? bit vlpd controls the power-up state of the volume control attenuator. this is bit d0 of cfg0. this bit must be set to a zero to power-up the volume control. 7. select a volume control level?bits vol0, vol1, and vol2 control the state of the vol- ume control level. these are bits d11, d12, and d13, respectively, of cfg1. a binary count of 000 through 111 controls the amount of attenuation through that state. in most cases, the software will select an attenuation level according to the desires of the current users of the october 2000 pa g e 2 0 product. in this example, we will assume the user wants an attenuation of ?12 db. for that setting, d11 should be set to one, d12 should be set to one, and d13 should be set to a zero. 8. select the volume control path through the output mux ? these are bits d3 and d4, respectively, of cfg0. they should be set to the state where d3 is zero and d4 is a zero to select the volume control. 9. power up the speaker amplifier and select the high gain mode ? bits opa0 and opa1 control the state of the speaker (sp+ and sp?) and aux out outputs. these are bits d1 and d2 of cfg0. they must be set to the state where d1 is one and d2 is zero to power-up the speaker outputs in the high gain mode and to power-down the aux out. to set up the chip for memo or call playback, the configuration registers are set up as follows: cfg0=0010 0100 0010 0010 (hex 2422). cfg1=0101 1001 1101 0001 (hex 59d1). only those portions necessary for this mode are powered up. 3.11 message cueing message cueing allows the user to skip through analog messages without knowing the actual physical location of the message. this operation is used during playback. in this mode, the messages are skipped 512 times faster than in normal playback mode. it will stop when an eom marker is reached. then, the internal address counter will be pointing to the next message. october 2000 pa g e 2 1 4 analog mode 4.1 aux in and ana in description the aux in is an additional audio input to the isd5116, such as from the microphone circuit in a mobile phone ?car kit.? this input has a nominal 700 mv p-p level at its minimum gain setting (0 db). see the aux in amplifier gain settings table on page 26. additional gain is available in 3 db steps (controlled by the i 2 c serial interface) up to 9 db. the ana in pin is the analog input from the telephone chip set. it can be switched (by the serial bus) to the speaker output, the array input or to various other paths. this pin is designed to accept a nominal 1.11 vp-p when at its minimum gain (6 db) setting. see the ana in amplifier gain settings table on page 25. there is additional gain available in 3 db steps controlled from the i 2 c interface, if required, up to 15 db. ana in input amplifier ana in input c coup =0.1 rac coup 1 aux in input amplifier aux in input c coup =0.1 rac coup 1 october 2000 pa g e 2 2 4.2 isd5116 analog structure (left half) description in put agc amp su m 1 2 (s1m1,s1m0) so ur c e mux sum1 summing amp aux in amp filto su m1 mux an a in a mp ar ra y 2 (s1s1,s1s0) (ins0) 1514131211109876543210 aig1 aig0 aipd axg1 axg0 axpd in s0 aos2 aos1 aos0 aopd ops1 ops0 opa1 opa0 vlpd cfg0 1514131211109876543210 vls1 vl s0 v ol 2 vo l1 v ol 0 s1s1 s1s0 s1m1 s1m0 s2m1 s2m0 fls0 fld1 fld0 flpd agpd cfg1 4.3 isd5116 analog structure (right half) description sum1 su m2 2 (s2 m 1,s2 m0 ) filte r mux sum2 summing amp array 2 filto low pass filter in t e rn al clock multilevel sto ra g e array 1 (fls0) 1 (flpd) array ana in amp xclk (fld 1,fl d0) 15 1 4 13 1 2 11 1 0 9 8 7 6 5 4 3 2 1 0 vls1 vls0 vol2 vol1 vol0 s1s1 s1s0 s1m1 s1m0 s2m1 s2m0 fls0 fld1 fld0 flpd agpd cfg1 inp inso source 0 agc amp 1aux in amp s1m1 s1m0 source 00both 01sum1 mux only 10inp only 1 1 power down s1s1 s1s0 source 0 0 ana in 0 1 array 10filto 11n/c fls0 source 0sum1 1 array flpd condition 0power up 1power down s1m1 s1m0 source 00both 0 1 ana in only 10filto only 1 1 power down fld1 fld0 sample rate filter bandw idth 0 0 8 khz 3.6 khz 0 1 6.4 khz 2.9 khz 1 0 5.3 khz 2.4 khz 1 1 4.0 khz 1.8 khz filter mux filto october 2000 pa g e 2 3 4.4 volume control description vo l su m 2 vol mux su m 1 in p 2 an a in a mp vol um e control (v ls1,v ls0) 3 ( vol 2,v ol1 ,vol0 ) 1 (vl pd) 4.5 speaker and aux out description sp ea k e r sp+ sp? aux out car kit (1 vp-p max) ana in amp output mux filto su m 2 2 vol (ops1,ops0) 2 (opa1, opa0) ins0 1514131211109876543210 aig1 aig0 aipd axg1 axg0 axpd aos2 aos1 aos0 aopd ops1 ops0 opa1 opa0 vl pd cfg0 vlpd condition 0power up 1power down vls1 vls0 source 0 0 ana in amp 01sum2 10sum1 11inp vol2 vol1 vol0 attenuation 000 0 db 001 4 db 010 8 db 0 1 1 12 db 1 0 0 16 db 1 0 1 20 db 1 1 0 24 db 1 1 1 28 db ins0 aig1 aig0 aipd axg1 axg0 axpd aos2 aos1 aos0 aopd ops1 ops0 opa1 opa0 vl pd cfg0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 vls1 v ls0 vo l2 vo l 1 s1s1 s1s0 s1m1 s1m0 s2m1 s2m0 fls0 fld1 fld0 flpd agpd cfg1 vo l0 ops1 ops0 source 00vol 0 1 ana in 10filto 11sum2 opa1 opa0 spkr drive aux out 0 0 power down power down 01 3.6 v p-p @ 150 ? power down 10 23.5 mwatt @ 8 ? power down 1 1 power down 1 v p-p max @ 5 k ? october 2000 pa g e 2 4 4.6 ana out description chip set an a ou t + an a ou t ? *vol *filto *sum2 3 (aos2,aos1,aos0) *fthru 1 (aopd) *inp *sum1 ( 1 vp -p m ax. f r om a ux in o r a rra y) (694 mvp-p max. from microphone input) ins0 15 1 4 13 1 2 11 1 0 9 8 7 6 5 4 3 2 1 0 ai g1 aig0 aipd axg1 axg0 axpd aos2 aos1 aos0 aopd ops1 ops0 opa1 opa0 vlpd cfg0 4.7 analog inputs 4.7.1 microphone inputs the microphone inputs transfer the voice signal to the on-chip agc preamplifier or directly to the ana out mux, depending on the selected path. the direct path to the ana out mux has a gain of 6 db so a 208 mv p-p signal across the differential microphone inputs would give 416 mv p-p across the ana out pins. the agc circuit has a range of 45 db in order to deliver a nominal 694 mv p-p into the storage array from a typical electric microphone output of 2 to 20 mv p-p. the input impedance is typically 10k ? . the acap pin provides the capacitor connection for setting the parameters of the microphone agc circuit. it should have a 4.7 f capacitor connected to ground. it cannot be left floating. this is because the capacitor is also used in the playback mode for the automute circuit. this circuit reduces the amount of noise present in the output during quiet pauses. tying this pin to ground gives maximum gain; to vcca gives minimum gain for the agc amplifier but will cancel the automute function. mic+ mic? acap fthru agc 1 ( ag pd) 6 db to automute (playback only) * * differential path agc 1514131211109876543210 vls1 vls0 vol2 vol1 vol0 s1s1 s1s0 s1m1 s1m0 s2m1 s2m0 fls0 fld1 fld0 flpd ag pd cfg1 agpd condition 0power up 1power down aos2 aos1 aos0 source 0 0 0 fthru 001inp 010vol 011filto 100sum1 101sum2 110n/c 111n/c aopd condition 0power up 1power down *differential path mic in october 2000 pa g e 2 5 ana in (analog input) the ana in pin is the analog input from the telephone chip set. it can be switched (by the i 2 c interface) to the speaker output, the array input or to various other paths. this pin is designed to accept a nominal 1.11 v p-p when at its minimum gain (6 db) setting. there is additional gain available, if required, in 3 db steps, up to 15 db. the gain settings are controlled from the i 2 c interface. ana in input modes ana in amplifier gain settings 1. gain from ana in to sp+/- 2. gain from ana in to array in 3. 0tlp input is the reference transmission level point that is used for testing. this level is typically 3 db below clipping 4. speaker out gain set to 1.6 (high). (differential) gain setting resistor ratio (rb/ra) gain gain 2 (db) 00 63.9 / 102 0.625 -4.1 01 77.9 / 88.1 0.883 -1.1 10 92.3 / 73.8 1.250 1.9 11 106 / 60 1.767 4.9 cfg0 setting (1) 0tlp input v p-p (3) aig1 aig0 gain (2) array in/out v p-p speaker out v p-p (4) 6 db 1.110 0 0 0.625 0.694 2.22 9 db 0.785 0 1 0.883 0.694 2.22 12 db 0.555 1 0 1.250 0.694 2.22 15 db 0.393 1 1 1.767 0.694 2.22 aux in (auxiliary input) the aux in is an additional audio input to the isd5116, such as from the microphone circuit in a mobile phone ?car kit.? this input has a nominal 694 mv p-p level at its minimum gain setting (0 db). see the following table. additional gain is available in 3 db steps (controlled by the i 2 c interface) up to 9 db. october 2000 pa g e 2 6 aux in input modes aux in amplifier gain settings cfg0 setting (1) 0tlp input v p-p (3) aig1 aig0 gain (2) array in/out v p-p speaker out v p-p (4) 0 db 0.694 0 0 1.00 0.694 0.694 3 db 0.491 0 1 1.41 0.694 0.694 6 db 0.347 1 0 2.00 0.694 0.694 9 db 0.245 1 1 2.82 0.694 0.694 1. gain from aux in to ana out 2. gain from aux in to array in 3. 0tlp input is the reference transmission level point that is used for testing. this level is typically 3 db below clipping 4. differential gain setting resistor ratio (rb/ra) gain gain (2) (db) 00 40.1 / 40.1 1.0 0 01 47.0 / 33.2 1.414 3 10 53.5 / 26.7 2.0 6 11 59.2 / 21 2.82 9 p a g e 2 7 5 digital mode 5.1 writing data the digital write function allows the user to select a portion of the array to be used as digital memory. the partition between analog and digital memory is left up to the user. a page can only be either digital or analog, not both. the minimum addressable block of memory in the digital mode is one block or 64 bits, when reading or writing. the address sent to the device is the 11-bit row (or page) address with the 5-bit scan (or block) address. however, one must send a digital erase before attempting to change digital data on a page. this means that even when changing only one of the 32 blocks, all 32 will need to be rewritten to the page. after the address is entered, the data is sent in one-byte packets followed by an i 2 c acknowledge generated by the chip. data for each block is sent msb first. the data transfer is ended when the master generates an i 2 c stop condition. if only a partial block of data is sent before the stop condition, zero is ?written? in the remaining bytes; that is, they are left at the erase level. an erased page (row) will be read as all zeros. the device can buffer up to two blocks of data. if the device is unable to accept more data due to the internal write process, the scl line will be held low indicating to the master to halt data transfer. if the device encounters an overflow condition, it will respond by generating an interrupt condition and an i 2 c not acknowledge signal after the last valid byte of data. once data transfer is terminated, the device needs up to two cycles (64 us) to complete its internal write cycle before another command is sent. if an active command is sent before the internal cycle is finished, the part will hold scl low until the current command is finished. 5.2 reading data the digital read command utilizes the combined i 2 c command format. that is, a command is sent to the chip using the write data direction. then the data direction is reversed by sending a repeated start condition, and the slave address with r/w set to 1. after this, the slave device (isd5116) begins to send data to the master until the master generates a not acknowledge. if the part encounters an overflow condition, the int pin is pulled low. no other communication with the master is possible due to the master generating ack signals. as with digital write, digital read can be done a ?block? at a time. thus, only 64 bits need be read in each digital read command sequence. 5.3 erasing data the digital erase command can only erase an entire page at a time. this means that only the d1 command needs to include the 11-bit page address; the 5-bit for block address are left at 00000. once a page has been erased, each block may be written separately, 64 bits at a time. but, if a block has been previously written then the entire page of 2048 bits must be erased in order to re-write (or change) a block. a sequence might be look like: - read the entire page - store it in ram - change the desired bit(s) - erase the page - write the new data from ram to the entire page p a g e 2 8 5.4 example command sequences an explanation and graphical representation of the write, read and erase operations are found below. 1. write digital data for the normal digital addressed mode the registers are loaded as follows: 1. host executes i 2 c start 2. send slave address with r/w bit = ?0? (write) 3. slave responds back with an ack. 4. wait for scl high 5. host sends a byte to slave - (command byte = c9h) 6. slave responds with an ack 7. wait for scl high 8. host sends a byte to slave - (high address byte) 9. slave responds with an ack 10. wait for scl high 11. host sends a byte to slave - (low address byte) 12. slave responds with an ack 13. wait for scl high 14. host sends a byte to slave - (first 8 bits of digital information) 15. slave responds with an ack 16. wait for scl high 17. steps 14, 15 and 16 are repeated until last byte is sent and acknowledged 18. host executes i 2 c stop s slave address a w command byte c9h a data a data a high addr. byte low addr. byte data a data a ~ ~ ~ ~ p data a october 2000 pa g e 2 9 2. read digital data for a normal digital read, the registers are loaded as follows: 1. host executes i 2 c start 2. send slave address with r/w bit = ? 0 ? (write) 3. slave responds back with an ack 4. wait for scl high 5. host sends a byte to slave - (command byte = e1) 6. slave responds with an ack 7. wait for scl high 8. host sends a byte to slave - (high address byte) 9. slave responds with an ack. 10. wait for scl high 11. host sends a byte to slave - (low address byte) 12. slave responds with an ack 13. wait for scl high 14. host sends repeat start 15. host sends slave address with r/w bit = 1 (reverses data direction) 16. slave responds with an ack 17. wait for scl high 18. slave sends a byte to host - (first 8 bits of digital information) 19. host responds with an ack 20. wait for scl high 21. steps 18, 19 and 20 are repeated until last byte is sent and a no ack is returned 22. host executes i 2 c stop a s slave address w command byte c9h a data a data a high addr. byte low addr. byte data a data a ~ ~ ~ ~ p data n a s slave address r p a g e 3 0 3. erase digital data 1. host executes i 2 c start 2. send slave address with r/w bit = ?0? (write) 3. slave responds back with an ack 4. wait for scl to go high 5. host sends a byte to slave - (command byte = d1) 6. slave responds with an ack 7. wait for scl to go high 8. host sends a byte to slave - (high address byte) 9. slave responds with an ack. 10. wait for scl to go high 11. host sends a byte to slave - (low address byte) 12. slave responds with an ack 13. wait for scl to go high 14. host executes i 2 c stop 15. host counts rac cycles to track where the chip is in the erase operation. 16. host determines erase of final row has begun 17. host executes i 2 c start 18. send slave address with r/w bit = ?0? (write) 19. slave responds back with an ack 20. wait for scl to go high 21. host sends a byte to slave - (command byte = 80) 22. slave responds back with an ack 23. wait for scl to go high 24. host executes i 2 c stop a s slave address w command byte d1h a data a data a high addr. byte low addr. byte a s slave address w p command byte 80h erase starts on falling edge of slave acknowledge note 2 "n" rac cycles note 3. last erased row note 4. a p notes 1. erase operations must be addressed on a row boundary. the 5 lsb bits of the low address byte will be ignored. 2. i2c bus is released while erase proceeds. other devices may use the bus until it is time to execute the stop command that causes the end of the erase operation. 3. host processor must count rac cycles to determine where the chip is in the erase process, one row per rac cycle. rac pulses low for 0.25 microsecond at the end of each erased row. the erase of the "next" row begins with the rising edge of rac. see the digital erase rac timing diagram on page 32. 4. when the erase of the last desired row begins, the following stop command (command byte = 80 hex) must be issued. this command must be completely given, including receiving the ack from the slave before the rac pin goes high .25 microseconds before the end of the row. october 2000 pa g e 3 1 6 pin descriptions 6.1 digital i/o pins scl (serial clock line) the serial clock line is a bi-directional clock line. it is an open-drain line requiring a pull-up resistor to vcc. it is driven by the "master" chips in a system and controls the timing of the data exchanged over the serial data line. sda (serial data line) the serial data line carries the data between devices on the i 2 c interface. data must be valid on this line when the scl is high. state changes can only take place when the scl is low. this is a bi- directional line requiring a pull-up resistor to vcc. rac (row address clock) rac is an open drain output pin that normally marks the end of a row. at the 8 khz sample frequency, the duration of this period is 256 ms. there are 2048 pages of memory in the isd5116 devices. rac stays high for 248 ms and stays low for the remaining 8 ms before it reaches the end of the page. 1 row rac waveform during 8 khz operation 256 msec t rac 8 msec t raclo the rac pin remains high for 500 sec and stays low for 15.6 sec under the message cueing mode. see the timing parameters table on page 39 for rac timing information at other sample rates. w hen a record command is first initiated, the rac pin remains high for an extra t raclo period, to load sample and hold circuits internal to the device. the rac pin can be used for message management techniques. 1 row rac waveform during message cueing 500 usec t rac 15.6 us t raclo october 2000 pa g e 3 2 rac waveform during digital erase sample rate 4.0 khz 5.3 khz 6.4 khz 8.0 khz t rac 2.5s 1.87s 1.56s 1.25s t racl0 0.5s 0.37s 0.31s 0.25s t racl1 2.0s 1.50s 1.25s 1.00s int (interrupt) int is an open drain output pin. the isd5116 interrupt pin goes low and stays low when an overflow (ovf) or end of message (eom) marker is detected. each operation that ends in an eom or ovf generates an interrupt, including the message cueing cycles. the interrupt is cleared by a read status instruction that will give a status byte out the sda line. xclk (external clock input) the external clock input for the isd5116 product has an internal pull-down device. normally, the isd5116 is operated at one of four internal rates selected for its internal oscillator by the sample rate select bits. if greater precision is required, the device can be clocked through the xclk pin at 4.096 mhz as described in section 4.3 on page 22. because the anti-aliasing and smoothing filters track the sample rate select bits, one must, for optimum performance, maintain the external clock at 4.096 mhz and set the sample rate configuration bits to one of the four values to properly set the filters to the correct cutoff frequency as described in section 4.3 on page 22. the duty cycle on the input clock is not critical, as the clock is immediately divided by two internally. if the xclk is not used, this input should be connected to v ssd . external clock input table duration (minutes) sample rate (khz) required clock (khz) fld1 fld0 filter knee (khz) 8.73 8.0 4096 0 0 3.4 10.9 6.4 4096 0 1 2.7 13.1 5.3 4096 1 0 2.3 17.5 4.0 4096 1 1 1.7 a0, a1 (address pins) these two pins are normally strapped for the desired address that the isd5116 will have on the i 2 c serial interface. if there are four of these devices on the bus, then each must be strapped differently in order to allow the master device to address them individually. the possible addresses range from 80h to 87h, depending upon whether the device is being written to, or read from, by the host. the isd5116 has a 7- bit slave address of which only a0 and a1 are pin programmable. the eighth bit (lsb) is the r/w bit. thus, the address will be 1000 0xy0 or 1000 0xy1. (see the table in section 3.1.1 on page 9.) . 25 sec 1 . 25 sec october 2000 pa g e 3 3 6.2 analog i/o pins mic+, mic- (microphone input +/-) the microphone input transfers the voice signal to the on-chip agc preamplifier or directly to the ana out mux, depending on the selected path. the direct path to the ana out mux has a gain of 6 db so a 208 mv p-p signal across the differential microphone inputs would give 416 mv p-p across the ana out pins. the agc circuit has a range of 45 db in order to deliver a nominal 694 mv p-p into the storage array from a typical electret microphone output of 2 to 20 mv p-p. the input impedance is typically 10 k ? ? ? + ? and ?? ? pins to a nominal voltage level of 700 mv p-p. both pins have dc bias of approximately 1.2 vdc. the ac signal is superimposed upon this analog ground voltage. these pins can be used single-ended, getting only half the voltage. do not ground the unused pin. acap (agc capacitor) this pin provides the capacitor connection for setting the parameters of the microphone agc circuit. it should have a 4.7 f capacitor connected to ground. it cannot be left floating. this is because the capacitor is also used in the playback mode for the automute circuit. this circuit reduces the amount of noise present in the output during quiet pauses. tying this pin to ground gives maximum gain; tying it to v cca gives minimum gain for the agc amplifier but cancels the automute function. sp +, sp- (speaker +/-) this is the speaker differential output circuit. it is designed to drive an 8 ? ? ? ? ? ? october 2000 pa g e 3 4 aux out (auxiliary output) the aux out is an additional audio output pin to be used, for example, to drive the speaker circuit in a ? car kit. ? it drives a minimum load of 5 k ? speak er sp+ sp? aux out car kit (1 vp-p max) ana in amp output mux filto sum2 2 vo l (ops1,ops0) 2 (opa1, opa0) ins0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 aig1 aig0 aipd axg1 axg0 axpd aos2 aos1 aos0 aopd ops1 ops0 opa1 opa0 vl pd cfg0 ana in (analog input) the ana in pin is the analog input from the telephone chip set. it can be switched (by the i 2 c interface) to the speaker output, the array input or to various other paths. this pin is designed to accept a nominal 1.11 v p-p when at its minimum gain (6 db) setting. there is additional gain available, if required, in 3 db steps, up to 15 db. the gain settings are controlled from the i 2 c interface. ana in input modes gain setting resistor ratio (rb/ra) gain gain 2 (db) 00 63.9 / 102 0.625 -4.1 01 77.9 / 88.1 0.88 -1.1 10 92.3 / 73.8 1.25 1.9 11 106 / 60 1.77 4.9 ops1 ops0 source 00vol 0 1 ana in 10filto 11sum2 ops1 opa0 spkr drive aux out 0 0 power down power down 0 1 3.6 v p.p @150 ? ? ? october 2000 pa g e 3 5 ana in amplifier gain settings cfg0 setting (1) 0tlp input v p-p (3) aig1 aig0 gain (2) array in/out v p-p speaker out v p-p (4) 6 db 1.110 0 0 0.625 0.694 2.22 9 db 0.785 0 1 0.883 0.694 2.22 12 db 0.555 1 0 1.250 0.694 2.22 15 db 0.393 1 1 1.767 0.694 2.22 1. gain from ana in to sp+/- 2. gain from ana in to array in 3. 0tlp input is the reference transmission level point that is used for testing. this level is typically 3 db below clipping 4. speaker out gain set to 1.6 (high). (differential) aux in (auxiliary input) the aux in is an additional audio input to the isd5116, such as from the microphone circuit in a mobile phone ? car kit. ? this input has a nominal 694 mv p-p level at its minimum gain setting (0 db). see the aux in amplifier gain settings table on page 26. additional gain is available in 3 db steps (controlled by the i 2 c interface) up to 9 db. aux in input modes aux in amplifier gain settings cfg0 setting (1) 0tlp input v p-p (3) aig1 aig0 gain (2) array in/out v p-p speaker out v p-p (4) 0 db 0.694 0 0 1.00 0.694 0.694 3 db 0.491 0 1 1.41 0.694 0.694 6 db 0.347 1 0 2.00 0.694 0.694 9 db 0.245 1 1 2.82 0.694 0.694 1. gain from aux in to ana out 2. gain from aux in to array in 3. 0tlp input is the reference transmission level point that is used for testing. this level is typically 3 db below clipping 4. differential gain setting resistor ratio (rb/ra) gain gain (2) (db) 00 40.1 / 40.1 1.0 0 01 47.0 / 33.2 1.414 3 10 53.5 / 26.7 2.0 6 11 59.2 / 21 2.82 9 october 2000 pa g e 3 6 6.3 power and ground pins v cca , v ccd (voltage inputs) to minimize noise, the analog and digital circuits in the isd5116 device use separate power busses. these +3 v busses lead to separate pins. tie the v ccd pins together as close as possible and decouple both supplies as near to the package as possible. v ssa , v ssd (ground inputs) the isd5116 series utilizes separate analog and digital ground busses. the analog ground (v ssa ) pins should be tied together as close to the package as possible and connected through a low-impedance path to power supply ground. the digital ground (v ssd ) pin should be connected through a separate low impedance path to power supply ground. these ground paths should be large enough to ensure that the impedance between the v ssa pins and the v ssd pin is less than 3 ? o o o o o o o o o o o o o o o o o o o o o o o o o o o o v c c d xclk analog ground 1 v ssa to v cca v s s d (digital ground) note 1: v ssd traces should be kept separated back to the v ss supply feed point.. note 2: v ccd traces should be kept separate back to the v cc supply feed point. note 3: the digital and analog grounds tie together at the power supply. the v cca and v ccd supplies will also need filter capacitors per good engineering practice (typ. 50 to 100 uf). c1 c2 c3 note 1 note 2 c1=c2=c3=0.1 uf chip capacitors note 3 note 3 october 2000 pa g e 3 7 7 electrical characteristics and parameters 7.1 electrical characteristics absolute maximum ratings (packaged parts) (1) condition value junction temperature 150 0 c storage temperature range -65 0 c to +150 0 c voltage applied to any pin (v ss - 0.3v) to (v cc + 0.3v) voltage applied to any pin (input current limited to +/-20 ma) (v ss ? 1.0v) to (v cc + 1.0v) lead temperature (soldering ? 10 seconds) 300 0 c v cc - v ss -0.3v to +5.5v 1. stresses above those listed may cause permanent damage to the device. exposure to the absolute maximum ratings may affect device reliability. functional operation is not implied at these conditions. absolute maximum ratings (die) (1) condition value junction temperature 150 0 c storage temperature range -65 0 c to +150 0 c voltage applied to any pad (v ss - 0.3v) to (v cc + 0.3v) v cc - v ss -0.3v to +5.5v 1. stresses above those listed may cause permanent damage to the device. exposure to the absolute maximum ratings may affect device reliability. functional operation is not implied at these conditions. operating conditions (packaged parts) condition value commercial operating temperature range (1) 0 0 c to +70 0 c extended operating temperature (1) -20 0 c to +70 0 c industrial operating temperature (1) -40 0 c to +85 0 c supply voltage (v cc ) (2) +2.7v to +3.3v ground voltage (v ss ) (3) 0v 1. case temperature 2. v cc = v cca = v ccd 3. v ss = v ssa = v ssd operating conditions (die) condition value die operating temperature range (1) 0 0 c to +50 0 c supply voltage (v cc ) (2) +2.7v to +3.3v ground voltage (v ss ) (3) 0v 1. case temperature 2. v cc = v cca = v ccd 3. v ss = v ssa = v ssd october 2000 pa g e 3 8 7.2 parameters general parameters symbol parameters min (2) typ (1) max (2) units conditions v il input low voltage v cc x 0.2 v v ih input high voltage v cc x 0.8 v v ol scl, sda output low voltage 0.4 v i ol = 3 ma v il2v input low voltage for 2v interface 0.4 v apply only to scl, sda v ih2v input high voltage for 2v interface 1.6 v apply only to scl, sda v ol1 rac, int output low voltage 0.4 v i ol = 1 ma v oh output high voltage v cc ? 0.4 v i ol = -10 1. typical values: t a = 25 c and vcc = 3.0 v. 2. all min/max limits are guaranteed by isd via electrical testing or characterization. not all specifications are 100 percent tested. 3. v cca and v ccd summed together. october 2000 pa g e 3 9 timing parameters symbol parameters min (2) typ (1) max (2) units conditions f s sampling frequency 8.0 6.4 5.3 4.0 khz khz khz khz (5) (5) (5) (5) f cf filter knee 8.0 khz (sample rate) 6.4 khz (sample rate) 5.3 khz (sample rate) 4.0 khz (sample rate) 3.4 2.7 2.3 1.7 khz khz khz khz knee point (3)(7) knee point (3)(7) knee point (3)(7) knee point (3)(7) t rec record duration 8.0 khz (sample rate) 6.4 khz (sample rate) 5.3 khz (sample rate) 4.0 khz (sample rate) 8.73 10.9 13.1 17.5 min min min min (6) (6) (6) (6) t play playback duration 8.0 khz (sample rate) 6.4 khz (sample rate) 5.3 khz (sample rate) 4.0 khz (sample rate) 8.73 10.9 13.1 17.5 min min min min (6) (6) (6) (6) t pud power-up delay 8.0 khz (sample rate) 6.4 khz (sample rate) 5.3 khz (sample rate) 4.0 khz (sample rate) 1 1 1 1 msec msec msec msec t stop or pause stop or pause record or play 8.0 khz (sample rate) 6.4 khz (sample rate) 5.3 khz (sample rate) 4.0 khz (sample rate) 32 40 48 64 msec msec msec msec t rac rac clock period 8.0 khz (sample rate) 6.4 khz (sample rate) 5.3 khz (sample rate) 4.0 khz (sample rate) 256 320 384 512 msec msec msec msec (9) (9) (9) (9) t raclo rac clock low time 8.0 khz (sample rate) 6.4 khz (sample rate) 5.3 khz (sample rate) 4.0 khz (sample rate) 8 10 12.1 16 msec msec msec msec t racm rac clock period in message cueing mode 8.0 khz (sample rate) 6.4 khz (sample rate) 5.3 khz (sample rate) 4.0 khz (sample rate) 500 625 750 1000 october 2000 pa g e 4 0 t race rac clock period in erase mode 8.0 khz (sample rate) 6.4 khz (sample rate) 5.3 khz (sample rate) 4.0 khz (sample rate) 1.25 1.56 1.87 2.50 msec msec msec msec tracml rac clock low time in message cueing mode 8.0 khz (sample rate) 6.4 khz (sample rate) 5.3 khz (sample rate) 4.0 khz (sample rate) 15.6 19.5 23.4 31.2 ? 40 db 0tlp input r mic microphone input resistance 10 k ? ? 45 db 0tlp input, 6 db setting r ana in ana in input resistance (6 db to +15 db) 10 to 100 k ? page 41 aux in (14) symbol parameters min (2) typ (1)(14) max (2) units conditions v aux in aux in input voltage 1.0 v peak-to-peak (0 db gain setting) v aux in (0tlp) aux in (0tlp) input voltage 694.2 mv peak-to-peak (0 db gain setting) a aux in (ana out) gain from aux in to ana out 0 to +9 db 4 steps of 3 db a aux in (ga) aux in gain accuracy -0.5 +0.5 db (11) a aux in (gt) aux in gain tracking +/-0.1 db 1000 hz, +3 to ?45 db 0tlp input, 0 db setting r aux in aux in input resistance 10 to 100 k ? depending on aux in gain speaker outputs (14) symbol parameters min (2) typ (1)(14) max (2) units conditions v sphg sp+/- output voltage (high gain setting) 3.6 v peak-to-peak, differential load = 150 ? , opa1, opa0 = 01 r splg sp+/- output load imp. (low gain) 8 ? opa1, opa0 = 10 r sphg sp+/- output load imp. (high gain) 70 150 ? opa1, opa0 = 01 c sp sp+/- output load cap. 100 pf v spag sp+/- output bias voltage (analog ground) 1.2 vdc v spdco speaker output dc offset +/-100 mv dc with ana in to speaker, ana in ac coupled to v ssa icn ana in/(sp+/-) ana in to sp+/- idle channel noise -65 db speaker load = 150 ? (12)(13) c r t (sp+/-)/ana out sp+/- to ana out cross talk -65 db 1 khz 0tlp input to ana in, with mic+/- and aux in ac coupled to v ss , and measured at ana out feed through mode (12) psrr power supply rejection ratio -55 db measured with a 1 khz, 100 mv p-p sine wave input at v cc and v cc pins f r frequency response (300- 3400 hz) + 0.5 db with 0tlp input to ana in, 6 db setting (12) guaranteed by design p outlg power output (low gain setting) 23.5 mw rms differential load at 8 ? sinad sinad ana in to sp+/- 62.5 db 0tlp ana in input minimum gain, 150 ? load (12)(13) page 42 ana out (14) symbol parameters min (2) type (1)(14) max (2) units conditions sinad sinad, mic in to ana out 62.5 db load = 5k ? (12)(13) sinad sinad, aux in to ana out (0 to 9 db) 62.5 db load = 5k ? (12)(13) ico nic/ana out idle channel noise ? microphone -65 db load = 5k ? (12)(13) icn aux in/ana out idle channel noise ? aux in (0 to 9 db) -65 db load = 5k ? (12)(13) psrr (ana out) power supply rejection ratio -55 db measured with a 1 khz, 100 mv p-p sine wave to v cca , v ccd pins v bias ana out+ and ana out- 1.2 vdc inputs ac coupled to v ssa v offset ana out+ to ana out- +/- 100 mv dc inputs ac coupled to v ssa r l minimum load impedance 5 k ? differential load f r frequency response (300- 3400 hz) + 0.5 db 0tlp input to mic+/- in feedthrough mode. 0tlp input to aux in in feedthrough mode (12) c r t ana out/(sp+/-) ana out to sp+/- cross talk -65 db 1 khz 0tlp output from ana out, with ana in ac coupled to v ssa , and measured at sp+/- (12) c r t ana out/aux out ana out to aux out cross talk -65 db 1 khz 0tlp output from ana out, with ana in ac coupled to v ssa , and measured at aux out (12) aux out (14) symbol parameters min (2) typ (1(14)) max (2) units conditions v aux out aux out ? maximum output swing 1.0 v 5k ? load r l minimum load impedance 5 k ? c l maximum load capacitance 100 pf v bias aux out 1.2 vdc sinad sinad ? ana in to aux out 62.5 db 0tlp ana in input, minimum gain, 5k load (12)(13) icn (aux out) idle channel noise ? ana in to aux out -65 db load=5k ? (12)(13) c r t aux out/ana out aux out to ana out cross talk -65 db 1 khz 0tlp input to ana in, with mic +/- and aux in ac coupled to v ssa , measured at sp+/-, load = 5k ? . referenced to nominal 0tlp @ output october 2000 pa g e 4 3 volume control (14) symbol parameters min (2) typ (1)(14) max (2) units conditions a out output gain -28 to 0 db 8 steps of 4 db, referenced to output absolute gain -0.5 +0.5 db ana in 1.0 khz 0tlp, 6 db gain setting measured differentially at sp+/- 1. typical values: t a = 25 c and vcc = 3.0v. 2. all min/max limits are guaranteed by isd via electrical testing or characterization. not all specifications are 100 percent tested. 3. low-frequency cut off depends upon the value of external capacitors (see pin descriptions). 4. differential input mode. nominal differential input is 208 mv p-p. (0tlp) 5. sampling frequency can vary as much as ? 6/+4 percent over the industrial temperature and voltage ranges. for greater stability, an external clock can be utilized (see pin descriptions). 6. playback and record duration can vary as much as ? 6/+4 percent over the industrial temperature and voltage ranges. for greater stability, an external clock can be utilized (see pin descriptions). 7. filter specification applies to the low pass filter. 8. for optimal signal quality, this maximum limit is recommended. 9. when a record command is sent, t rac = t rac + t raclo on the first page addressed. 10. the maximum signal level at any input is defined as 3.17 db higher than the reference transmission level point. (0tlp) this is the point where signal clipping may begin. 11. measured at 0tlp point for each gain setting. see the ana in table and aux in table on pages 25 and 26 respectively. 12. 0tlp is the reference test level through inputs and outputs. see the ana in table and aux in table on pages 25 and 26 respectively. 13. referenced to 0tlp input at 1 khz, measured over 300 to 3,400 hz bandwidth. 14. for die, only typical values are applicable. october 2000 pa g e 4 4 i 2 c interface timing standard-mode fast-mode parameter symbol min. max. min. max. unit scl clock frequency f scl 0 100 0 400 khz hold time (repeated) start condition. after this period, the first clock pulse is generated t hd; sta 4.0 - 0.6 - 1. a fast-mode i 2 c-interface device can be used in a standard-mode i 2 c-interface system, but the requirement t su;dat > 250 ns must then be met. this will automatically be the case if the device does not stretch the low period of the scl signal. if such a device does stretch the low period of the scl signal, it must output the next data bit to the sda line; t r max + t su;dat = 1000 + 250 = 1250 ns (according to the standard-mode i 2 c -interface specification) before the scl line is released. 2. c b = total capacitance of one bus line in pf. if mixed with hs mode devices, faster fall-times are allowed. october 2000 pa g e 4 5 8 timing diagrams 8.1 i 2 c timing diagram 8.2 playback and stop cycle sda scl ana in ana out data clock pulses stop play at addr t stop t start stop t low t sclk t high t f t r t su;dat t su;sto t f start sda scl stop october 2000 pa g e 4 6 8.3 example of power up command (first 12 bits) october 2000 pa g e 4 7 9 i 2 c serial interface technical information 9.1 characteristics of the i 2 c serial interface the i 2 c interface is for bi-directional, two-line communication between different ics or modules. the two lines are a serial data line (sda) and a serial clock line (scl). both lines must be connected to a positive supply via a pull-up resistor. data transfer may be initiated only when the interface bus is not busy. 9.1.1 bit transfer one data bit is transferred during each clock pulse. the data on the sda line must remain stable during the high period of the clock pulse, as changes in the data line at this time will be interpreted as a control signal. bit transfer on the i c-bus 2 data line stable; data valid change of data allowed sda scl 9.1.2 start and stop conditions both data and clock lines remain high when the interface bus is not busy. a high-to-low transition of the data line while the clock is high is defined as the start condition (s). a low -to-high transition of the data line while the clock is high is defined as the stop condition (p). definition of start and stop conditions handbook, full pagewidth mbc622 sda scl p stop condition sda scl s start condition october 2000 pa g e 4 8 9.1.3 system configuration a device generating a message is a ? transmitter ? ; a device receiving a message is the ? receiver ? . the device that controls the message is the ? master ? and the devices that are controlled by the master are the ? slaves ? . mbc645 sda scl micro - controller static ram or eeprom lcd driver gate array isd 5116 example of an i c-bus configuration using two microcontrollers 2 9.1.4 acknowledge the number of data bytes transferred between the start and stop conditions from transmitter to receiver is unlimited. each byte of eight bits is followed by an acknowledge bit. the acknowledge bit is a high level signal put on the interface bus by the transmitter during which time the master generates an extra acknowledge related clock pulse. a slave receiver which is addressed must generate an acknowledge after the reception of each byte. in addition, a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. the device that acknowledges must pull down the sda line during the acknowledge clock pulse so that the sda line is stable low during the high period of the acknowledge related clock pulse (set-up and hold times must be taken into consideration). a master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. in this event, the transmitter must leave the data line high to enable the master to generate a stop condition. acknowledge on the i 2 c-bus mbc602 s start condition 9821 clock pulse for acknowledgement not acknowledge acknowledge data output by transmitter data output by receiver scl from master october 2000 pa g e 4 9 9.2 i 2 c protocol since the i2c protocol allows multiple devices on the bus, each device must have an address. this address is known as a ? slave address ? . a slave address consists of 7 bits, followed by a single bit that indicates the direction of data flow. this single bit is 1 for a w rite cycle, which indicates the data is being sent from the current bus master to the device being addressed. this single bit is a 0 for a read cycle, which indicates that the data is being sent from the device being addressed to the current bus master. for example, the valid slave addresses for the isd5116 device, for both write and read cycles, are shown in section 3.1.1 on page 9 of this datasheet. before any data is transmitted on the i2c interface, the current bus master must address the slave it wishes to transfer data to or from. the slave address is always sent out as the 1 st byte following the start condition sequence. an example of a master transmitting an address to a isd5116 slave is shown below. in this case, the master is writing data to the slave and the r/w bit is ? 0 ? , i.e. a write cycle. all the bits transferred are from the master to the slave, except for the indicated acknowledge bits. the following example details the transfer explained in section 3.1.2-3 on page 10 of this datasheet . master transmits to slave receiver (write) mode swaaaap slave address command byte high addr. byte low addr. byte acknowledgement from slave acknowledgement from slave acknowledgement from slave acknowledgement from slave r/w start bit stop bit a common procedure in the isd5116 is the reading of the status bytes. the read status condition in the isd5116 is triggered when the master addresses the chip with its proper slave address, immediately followed by the r/w bit set to a ? 0 ? and without the command byte being sent. this is an example of the master sending to the slave, immediately followed by the slave sending data back to the master. the ? n ? not-acknowledge cycle from the master ends the transfer of data from the slave. the following example details the transfer explained in section 3.1.2-1 on page 9 of this datasheet. master reads from slave immediately after first byte (read mode) r/w from master start bit from master stop bit from master acknowledgement from sla ve acknowledgement from m a ste r not-acknowledged from m a ste r acknowledgement from m a ste r from master from slave from slave from slave sra a a n p low addr byte slave address status word high addr. byte another common operation in the isd5116 is the reading of digital data from the chip ? s memory array at a specific address. this requires the i 2 c interface master to first send an address to the isd5116 slave device, and then receive data from the slave in a single i 2 c operation. to accomplish this, the data direction r/w bit must be changed in the middle of the command. the following example shows the master sending the slave address, then sending a command byte and 2 bytes of address data to the isd5116, and then immediately changing the data direction and reading some number of bytes from the chip ? s digital array. an unlimited number of bytes can be read in this operation. the ? n ? not-acknowledge october 2000 pa g e 5 0 cycle from the master forces the end of the data transfer from the slave. the following example details the transfer explained in section 5.4-2 on page 29 of this datasheet. master reads from the slave after setting data address in slave (write data address, read data) swa a a a slave address command byte high addr. byte low addr. byte acknowledgement from slave acknowledgement from slave acknowledgement from slave acknowledgement from slave r/w from master start bit from master sra a a n p 8 bits of data slave address 8 bits of data 8 bits of data r/w from master start bit from master stop bit from master acknowledgement from slave acknowledgement from master not-acknowled from master acknowledgement from master from master from slave from slave from slave october 2000 pa g e 5 1 10 device physical dimensions 10.1. plastic thin small outline package (tsop) type e dimensions 5 6 7 8 9 10 11 12 13 14 2 3 4 15 16 17 18 19 20 21 22 23 24 25 26 27 28 a b g f c d e h j i min nom max min nom max a 0.520 0.528 0.535 13.20 13.40 13.60 b 0.461 0.465 0.469 11.70 11.80 11.90 c 0.311 0.315 0.319 7.90 8.00 8 .10 d 0.002 0.006 0.05 0.15 e 0.007 0.009 0.011 0.17 0.22 0 .27 f 0.0217 0.55 g 0.037 0.039 0.041 0.95 1.00 1 .05 h 0 0 3 0 6 0 0 0 3 0 6 0 i 0.020 0.022 0.028 0.50 0.55 0 .70 j 0.004 0.008 0.10 0.21 note: lead coplanarity to be within 0.004 inches. inches millimeters plastic thin small outline package (tsop) type e dimensions october 2000 pa g e 5 2 10.2. plastic small outline integrated circuit (soic) dimensions 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 45 67 8 910 11 12 13 14 a d e f b g c h min nom max m in nom max a 0.701 0.706 0.711 17.81 17.93 18.06 b 0.097 0.101 0.104 2.46 2.56 2.64 c 0.292 0.296 0.299 7.42 7.52 7.59 d 0.005 0.009 0.0115 0.127 0.22 0.29 e 0.014 0.016 0.019 0.35 0.41 0.48 f 0.050 1.27 g 0.400 0.406 0.410 10.16 10.31 10.41 h 0.024 0.032 0.040 0.61 0.81 1.02 note: lead coplanarity to be within 0.004 inches. plastic small outline integrated circuit (soic) dimensions inches millimeters october 2000 pa g e 5 3 10.3 plastic dual inline package (pdip) dimensions plastic dual inline package (pdip) (p) dimensions october 2000 pa g e 5 4 10.4 die bonding physical layout isd5116 device pin/pad locations with respect to die center in micron (m) pin pin name x axis y axis v ssd v ss digital ground -1842.90 3848.65 v ssd v ss digital ground -1671.30 3848.65 ad0 address 0 -1369.40 3848.65 sda serial data address -818.20 3848.65 ad1 address 1 -560.90 3848.65 scl serial clock line -201.40 3848.65 v ccd v cc digital supply voltage 73.20 3848.65 v ccd v cc digital supply voltage 288.60 3848.65 xclk external clock input 475.60 3848.65 int interrupt 787.40 3848.65 rac row address clock 1536.20 3848.65 v ssa v ss analog ground 1879.45 3848.65 v ssa ? ? ? -1948.00 -3841.60 mic+ non-inverting microphone input -1742.20 -3841.60 mic- inverting microphone input -1509.70 -3841.60 ana out+ non-inverting analog output -1248.00 -3841.60 ana out- inverting analog output -913.80 -3841.60 acap agc/automute cap -626.50 -3841.60 sp- speaker negative -130.70 -3841.60 v ssa v ss analog ground 202.90 -3841.60 sp+ speaker positive 626.50 -3841.60 v cca v cc analog supply voltage 960.10 -3841.60 ana in analog input 1257.40 -3841.60 aux in auxiliary input 1523.00 -3841.60 aux out auxiliary output 1767.20 -3841.60 october 2000 pa g e 5 5 isd 5116 series bonding physical layout (1) (unpackaged die) isd5116 series die dimensions x: 4125 um y: 8030 um die thickness (3) 292.1 um + 12.7 um pad opening (min) 90 x 90 microns 3.5 x 3.5 mils v ssd isd5116 v ss a v ss a mic+ au x i n an a in an aou t + mic ? v ssa (2 ) anaout ? acap auxout sp ? v cc a (2 ) sp+ rac v ssd ad0 sda ad l scl v ccd v ccd in t xclk 1. the backside of die is internally connected to vss. it must not be connected to any other potential or damage may occur. 2. double bond recommended. 3. this figure reflects the current die thickness. please contact isd as this thickness may change in the future. october 2000 pa g e 5 6 11 ordering information isd part number description when ordering isd5116 series devices, please refer to the following valid part numbers. part number isd5116e isd5116ed isd5116ei isd5116s isd5116sd isd5116si isd5116x ISD5116P chip scale package is available upon customer ? s request. for the latest product information, access our website at www.winbond-usa.com. special temperature field: blank = commercial packaged (0 c to +70 c) or commercial die (0 c to +50 c) d = extended ( ? 20 c to +70 c) i = industrial ( ? 40 c to +85 c) package type: e = 28-lead 8x13.4mm plastic thin small outline package (tsop) type 1 s = 28-lead 0.300-inch plastic small outline package (soic) x =die p = 28-lead 0.600-inch plastic dual inline packa g e ( pdip ) product family isd5116 pr oduct (8- to 16-minute durations) isd5116 -_ _ |
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